Professor Alex Volinsky
Professor Alex Volinsky is an academic podcast where each episode covers one of the host's research publications in materials science.
Ep 556: Hot Drawing the First Tube
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Hot Drawing of Fiber Metal Composite Tubes
Ep 555: Modeling the Furnace
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Mathematical Model of the Thermocompression Equipment Heating
Ep 554: Composite Tubes by Computer
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CAD/CAM System for Metal Matrix Fiber Composite Tubes Production
Ep 553: Predicting Copper Adhesion
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Quantitative Modeling and Measurement of Copper Thin Film Adhesion
https://doi.org/10.1557/proc-539-277
Ep 552: When Water Attacks Adhesion
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Environmental Effects on Cu/SiO2 and Cu/Ti/SiO2 Thin Film Adhesion
Ep 551: Testing Fine Lines, Big
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Macroscopic Modeling of Fine Lines Adhesion Tests
https://doi.org/10.1557/proc-563-297
Ep 550: Listening to Fracture
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Acoustic Emission Analysis of Fracture Events in Cu Films with W Overlayer
https://doi.org/10.1557/proc-563-275
Ep 549: Five Stages Under the Indenter
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Nanoindentation-Induced Defect-Interface Interactions: Phenomena, Methods and Limitations
https://doi.org/10.1016/s1359-6454(99)00270-0
Ep 548: The Stressed Superlayer
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Superlayer Residual Stress Effect on the Indentation Adhesion Measurements
https://doi.org/10.1557/proc-594-383
Ep 547: Annealing Gold-Chromium Films
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Annealing Effects on Interfacial Fracture of Gold-Chromium Films in Hybrid Microcircuits https://doi.org/10.1557/proc-586-195
Ep 546: Brittle to Ductile
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A Brittle to Ductile Transition (BDT) in Adhered Thin Films https://doi.org/10.1557/proc-594-351
Ep 545: Debonding Ductile Films
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Indentation-induced Debonding of Ductile Films https://doi.org/10.1557/proc-586-255
Ep 544: Ductile Layers, Tougher Joints
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The Role of Plasticity in Bimaterial Fracture with Ductile Interlayers https://doi.org/10.1007/s11661-000-1006-1
Ep 543: Geometry and Plasticity
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The Role of Geometry and Plasticity in Thin, Ductile Film Adhesion
Ep 542: Plasma Rescue for Copper
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Adhesion Quantification of Post-CMP Copper to Amorphous SiN Passivation by Nanoindentation https://doi.org/10.1557/proc-649-q6.1
Ep 541: Electroplated Copper, Up Close
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Microstructure and Mechanical Properties of Electroplated Cu Thin Films https://doi.org/10.1557/proc-649-q5.3
Ep 540: Modeling the Scratch Test
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Finite Element Analysis of the Precracked Line Scratch Test https://doi.org/10.1557/proc-657-ee5.9
Ep 539: Diffusion That Strengthens Gold
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Effects of Diffusion on Interfacial Fracture of Multilayer Hybrid Microcircuit Films, N.R. Moody, D. P. Adams
Ep 538: Screening Fragile Dielectrics
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Mechanical Properties, Adhesion, and Fracture Toughness of Low-K Dielectric Thin Films for Microelectronic Applications
Ep 537: Reading the Crack's Footprints
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Fiducial Marks as Measures of Thin Film Crack Arrest Toughness
https://doi.org/10.1016/s0013-7944(02)00003-6
Ep 536: Superlayers: The Final Report
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Thin Film Adhesion by Nanoindentation-induced Superlayers. Final Report
https://doi.org/10.2172/809372
Ep 535: Plastic Zones Under Pressure
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Substrate Effects on Indentation Plastic Zone Development in Thin Soft Films
https://doi.org/10.1557/jmr.2001.0434
Ep 534: Copper Stress on Barriers
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Residual Stress and Microstructure of Electroplated Cu Film on Different Barrier Layers
https://doi.org/10.1557/proc-695-l1.11.1
Ep 533: Gold Films That Stay Put
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Effects of Interface Structure on Gold Film Adhesion
Ep 532: Silicate Low-K Under the Indenter
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Nanoindentation of Silicate Low-K Dielectric Thin Films
https://doi.org/10.1557/proc-716-b12.13
Ep 531: Marks That Measure Toughness
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Crack Arrest Toughness Assessment Through Thin Film Fiducial Marks
Ep 530: Measuring Film Toughness
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Interfacial Toughness Measurements for Thin Films on Substrates
https://doi.org/10.1016/s1359-6454(01)00354-8
Ep 529: Fiducial Marks of Delamination
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Fiducial Mark and Nanocrack Zone Formation During Thin Film Delamination
https://doi.org/10.1080/01418610208240449
Ep 528: Low-K Films Under Pressure
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Fracture Toughness, Adhesion and Mechanical Properties of Low-K Dielectric Thin Films Measured by Nanoindentation
https://doi.org/10.1016/s0040-6090(03)00406-1
Ep 527: Watching Cords Be Born
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Experiments with In-situ Thin Film Phone Cord Delamination Propagation
Ep 526: The Sponge Has a Rule
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Incompressible Pore Effect on the Mechanical Behavior of Low-K Dielectric Films https://doi.org/10.1557/proc-750-y9.9
Ep 525: Chemistry Plus Plasticity
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Plasticity Effects on Interfacial Fracture of Thin Gold Films
Ep 524: The Interconnect Battlefield
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Mechanical Reliability and Characterization of Modern Microelectronic Interconnect Structures
Ep 523: Strain Is Free Performance
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Characterization Techniques for Evaluating Strained Si CMOS Materials https://doi.org/10.1063/1.1622475
Ep 522: Films That Shine
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Optical and Dielectric Properties of Eu- and Y-Polytantalate Thin Films https://doi.org/10.1557/proc-786-e3.31
Ep 521: Thermodynamics Did It
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Oxide Reduction in Advanced Metal Stacks for Microelectronic Applications https://doi.org/10.1557/proc-786-e6.33
Ep 520: One Bit, One Story
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Application of FIB/SEM and TEM to Single Bit Failure Analysis in SRAM arrays https://doi.org/10.1557/proc-782-a5.77
Ep 519: The Whole Fracture Gallery
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Fracture Patterns in Thin Films and Multilayers https://doi.org/10.1557/proc-795-u3.8
Ep 518: Tiny Crystal, Extreme Memory
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Irradiated Cubic Single Crystal SiC as a High Temperature Sensor https://doi.org/10.1557/proc-792-r5.3
Ep 517: Reading the Crack's Fossil
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Fiducial Mark and CTOA Estimates of Thin Film Adhesion
https://doi.org/10.1023/a:1024983930481
